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Rogers RO4350B Radio High Frequency PCB RF PCB Design Surface Mount PTFE Based

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Rogers RO4350B Radio High Frequency PCB RF PCB Design Surface Mount PTFE Based

Name: Rogers RO4350B Radio High Frequency PCB RF PCB Design Surface Mount PTFE Based
Brand: XSW PCB
Price: 1 USD

Model Number : XSWPCB

Material : Rogers RO4350B

MOQ : 1

Delivery Time : 8-15DAYS

Surface Finish : ENIG

Payment Terms : Western Union

Supply Ability : 1 Million Square feet/per month

Certification : UL ,IOS9000

Board Thickness : 1.0 mm (Customizable)

Place of Origin : China

Copper Thickness : 1/1/1/1/1/1/1/1 oz

Price : Negotiable

Brand Name : XSW PCB

Layer Count : 8-Layer

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Rogers RO4350B Radio High Frequency PCB RFPCB Surface Mount PTFE based

Rogers RO4350B Radio High Frequency PCB RFPCB Surface Mount PTFE-Based is a high-performance RF printed circuit board specifically designed for radio frequency, microwave, wireless communication, radar, and high-speed electronic applications. Manufactured using Rogers RO4350B high-frequency laminate, this RF PCB combines low dielectric loss, excellent dimensional stability, and superior thermal performance to deliver reliable signal transmission across a wide frequency range.

Key Specifications

Layer Count	8-Layer
Material	Rogers RO4350B
Board Thickness	1 mm (Customizable)
Copper Thickness	1/1/1/1/1/1/1/1 oz
Minimum Hole Size	0.1 mm
Minimum Line Width	0.1 mm
Minimum Line Spacing	0.1 mm
Solder Mask Color	Green
Surface Finish	ENIG

Product Description

Premium Rogers RO4350B High-Frequency Material

Rogers RO4350B laminate for RF and microwave applications.
Dielectric constant (Dk) approximately 3.48.
Stable electrical performance over a wide frequency range.

PTFE-Based RF Performance

Delivers low-loss characteristics similar to PTFE materials.
Excellent signal transmission efficiency.
Ideal for high-frequency and high-speed designs.

Low Dissipation Factor

Minimizes signal attenuation and insertion loss.
Improves RF system performance.
Suitable for microwave and millimeter-wave applications.

Excellent Signal Integrity

Supports controlled impedance circuit designs.
Reduces signal distortion and phase variation.
Ensures reliable high-frequency communication.

Surface Mount Technology (SMT) Compatible

Optimized for automated SMT assembly.
Supports fine-pitch and high-density components.
Improves assembly efficiency and product reliability.

Design Specifications

Item	Mass Production Capability	Extreme Capability
Board Thickness Range	0.3~6.0mm	0.3~6.0mm
Exposure Alignment Accuracy	±0.015mm	±0.005mm
Minimum Annular Ring	Single side ≥0.05mm	Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper)	0.05mm / 0.05mm	0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)	0.05mm / 0.05mm	0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)	0.075mm / 0.075mm	0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1/2oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1oz base copper)	±0.0075mm	±0.0075mm
Gold Finger Total Pitch Tolerance	<30mm: ±0.05mm 30~60mm: ±0.075mm	<30mm: ±0.03mm 30~60mm: ±0.05mm

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